Precision Wedge Locks for Conduction-Cooled Chassis
Mechanical Retention and Thermal Interface Hardware for VPX, CPCI, and ATR Modules
Perseus wedge locks, also known as card retainers, provide the mechanical-to-thermal interface for conduction-cooled VPX, CPCI, VME, ASAAC, and ATR chassis. Configurations include 3-segment, 5-segment, multi-segment, and tool-free designs with aerospace aluminum, stainless steel, and titanium alloy options by program requirement.
Core Technical Features
Mechanical-to-Thermal Interface:
Wedge locks clamp modules into chassis rails while helping reduce air gaps at the conduction path to the cold wall.
Configurable Segment Profiles:
3-segment, 5-segment, multi-segment, and tool-free designs support common rugged chassis architectures.
Material and Finish Options:
Aerospace aluminum, stainless steel, and titanium alloy options can be paired with hard anodize or chemical film finishes.
VITA-Compatible Integration:
Selection should be reviewed against VPX, CPCI, VME, ASAAC, ATR, and other chassis rail interfaces before release.
Typical Applications
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Secures conduction-cooled VPX and I/O modules in avionics chassis where thermal contact and retention are both required.
Airborne VPX Processor Modules
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Supports module retention in naval radar, communication, and control cabinets exposed to vibration and corrosion concerns.
Shipboard Electronics Cabinets
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Provides card retention for rugged vehicle electronics where shock, vibration, and maintainability drive hardware selection.
Ground Vehicle Electronics
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Tool-free or custom wedge lock options can support rapid module replacement in transportable systems.
Field-Deployable Chassis
Series Selection Guide
Wedge Lock Selection Guide
| Parameter | Available Configuration | Engineering Notes |
|---|---|---|
| Configurations | 3-segment / 5-segment / multi-segment / tool-free | Select by module length, rail geometry, and maintenance access. |
| Operating Temperature | -55°C to +85°C functional range | Confirm final range by selected material, finish, and platform requirement. |
| Materials | Aerospace aluminum / stainless steel / titanium alloys | Balance thermal path, corrosion exposure, mass, and strength. |
| Surface Finish | Hard anodize / chemical film | Finish should support conductivity and corrosion-control requirements. |
| Compatibility | VPX / CPCI / VME / ASAAC / ATR chassis rails | Verify rail geometry and torque procedure from module drawings. |
| RFQ Review | Length, height, segment count, finish, and release method | Custom profiles should be reviewed with drawings before quotation. |
Wedge Lock Overview
Perseus wedge locks provide mechanical retention and thermal interface support for conduction-cooled electronics modules. The product family is suited to VPX, CPCI, VME, ASAAC, ATR, and custom rugged chassis where secure clamping and repeatable module service access are required.
A reliable selection review compares module length, rail geometry, cold-wall interface, release method, material, finish, torque procedure, and environmental exposure before the final hardware profile is released.
- Interface data
Provide module drawing, rail geometry, and available clamping envelope.- Thermal path
Define cold-wall contact area and heat-transfer assumptions.- Hardware review
Confirm material, finish, segment count, and tool-free requirements.