Precision Wedge Locks for Conduction-Cooled Chassis

Mechanical Retention and Thermal Interface Hardware for VPX, CPCI, and ATR Modules
Perseus wedge locks, also known as card retainers, provide the mechanical-to-thermal interface for conduction-cooled VPX, CPCI, VME, ASAAC, and ATR chassis. Configurations include 3-segment, 5-segment, multi-segment, and tool-free designs with aerospace aluminum, stainless steel, and titanium alloy options by program requirement.

Core Technical Features

  • Mechanical-to-Thermal Interface:

    Wedge locks clamp modules into chassis rails while helping reduce air gaps at the conduction path to the cold wall.
  • Configurable Segment Profiles:

    3-segment, 5-segment, multi-segment, and tool-free designs support common rugged chassis architectures.
  • Material and Finish Options:

    Aerospace aluminum, stainless steel, and titanium alloy options can be paired with hard anodize or chemical film finishes.
  • VITA-Compatible Integration:

    Selection should be reviewed against VPX, CPCI, VME, ASAAC, ATR, and other chassis rail interfaces before release.

Typical Applications

  • Secures conduction-cooled VPX and I/O modules in avionics chassis where thermal contact and retention are both required.
    Airborne VPX Processor Modules
  • Supports module retention in naval radar, communication, and control cabinets exposed to vibration and corrosion concerns.
    Shipboard Electronics Cabinets
  • Provides card retention for rugged vehicle electronics where shock, vibration, and maintainability drive hardware selection.
    Ground Vehicle Electronics
  • Tool-free or custom wedge lock options can support rapid module replacement in transportable systems.
    Field-Deployable Chassis

Series Selection Guide

Wedge Lock Selection Guide

ParameterAvailable ConfigurationEngineering Notes
Configurations3-segment / 5-segment / multi-segment / tool-freeSelect by module length, rail geometry, and maintenance access.
Operating Temperature-55°C to +85°C functional rangeConfirm final range by selected material, finish, and platform requirement.
MaterialsAerospace aluminum / stainless steel / titanium alloysBalance thermal path, corrosion exposure, mass, and strength.
Surface FinishHard anodize / chemical filmFinish should support conductivity and corrosion-control requirements.
CompatibilityVPX / CPCI / VME / ASAAC / ATR chassis railsVerify rail geometry and torque procedure from module drawings.
RFQ ReviewLength, height, segment count, finish, and release methodCustom profiles should be reviewed with drawings before quotation.

Wedge Lock Overview

Perseus wedge locks provide mechanical retention and thermal interface support for conduction-cooled electronics modules. The product family is suited to VPX, CPCI, VME, ASAAC, ATR, and custom rugged chassis where secure clamping and repeatable module service access are required.

A reliable selection review compares module length, rail geometry, cold-wall interface, release method, material, finish, torque procedure, and environmental exposure before the final hardware profile is released.

  • Interface data
    Provide module drawing, rail geometry, and available clamping envelope.
  • Thermal path
    Define cold-wall contact area and heat-transfer assumptions.
  • Hardware review
    Confirm material, finish, segment count, and tool-free requirements.