Prometheus PCG38FLW312-20G-AB
50mm x 50mm x 20mm Frame
12V DC Platform
AESA Radar Cooling | Military Thermal Management | T/R Module Cooling | High-Altitude Cooling
Modern AESA radar systems and electronic warfare (EW) suites face a critical thermal challenge: T/R modules generate concentrated heat in confined spaces where traditional cooling architectures can lose margin. High-power RF components may operate from -55°C cold conditions to elevated desert ambient temperatures and in altitude-sensitive environments where reduced air density must be reviewed against the platform pressure profile. Perseus delivers high-performance cooling fans, fan-drive/control electronics, and integrated thermal solutions for aerospace and defense platforms. Qualification evidence should be reviewed against the final platform test plan before integration into high-density RF environments.
AESA radar cooling for airborne early warning payloads, with altitude derating reviewed against the aircraft pressure profile and enclosure impedance.
IP67-rated fan modules and GMZ isolators protect shipborne radar against salt-fog, humidity, and wave shock.
Stable thermal performance from -55°C arctic to +70°C desert without external cooling infrastructure."
EMI-stealth cooling manages 500 W/cm² heat flux without interfering with SIGINT signal chains."
Liquid cold plates with micro-channel architecture dissipate 500 W/cm² heat flux from dense T/R module arrays.
Integrated forced-air and conduction cooling for 3U/6U VPX chassis in airborne mission computing systems.
Mixed-flow impeller concepts support radar payload thermal management where reduced air density and compact UAV envelopes limit cooling margin.
High-duty-cycle laser and HPM systems require continuous 500W+ heat removal from compact weapon modules.
Ultra-low EMI cooling protects wideband signal receivers from 10 kHz to 40 GHz interference in ISR pods.
High-Pressure Airflow for Dense Arrays:
Challenge: Dense fin-stack heat sinks in radar enclosures create extreme back-pressure that standard fans cannot overcome. Engineering Solution: Perseus engineers high-pressure tubeaxial and mixed-flow impeller geometries for elevated system impedance. Altitude derating is reviewed against the platform pressure profile and enclosure impedance curve. Performance: Air-cooled chassis solutions can support total heat dissipation targets up to 2000 W per enclosure when validated against the final architecture.
Electromagnetic RFI/EMI Stealth:
Challenge: Cooling systems must not compromise sensitive SIGINT receivers or signal processing chains. Engineering Solution: Perseus BLDC motor designs can use internal filtering, shielded cabling, conductively grounded housings, and controlled commutation behavior to reduce emission risk. Result: EMI risk is reduced through filtering, grounding, and shielding controls; final MIL-STD-461G acceptance should be verified against the platform cable layout, operating mode, and test setup.
Structural-Thermal Integration (SWaP Optimization):
Challenge: Maximize cooling performance while minimizing Size, Weight, and Power (SWaP) for airborne and mobile platforms.Engineering Solution: We integrate lightweight magnesium-aluminum alloys and carbon fiber composite chassis manufacturing. Our thermal designs combine forced-air convection with conduction pathways to reduce fan power requirements.Hardware Integration: Integrated delivery of wedge locks, injectors, and ruggedized enclosures for VPX, CPCI, and ASAAC architectures.
| Cooling Method | Heat Flux Capacity | Weight Penalty | EMI Risk | Best For |
|---|---|---|---|---|
| Air-Cooled (Forced Convection) | Up to 200 W/cm² | Low | Low (with proper shielding) | Standard radar arrays, VPX chassis |
| Liquid-Cooled (Flow-Through) | Up to 500 W/cm² | Medium | None | High-power T/R modules, optical modules |
| Conduction-Cooled | Up to 100 W/cm² | High | None | Space-constrained pods, sealed enclosures |