Integrated Thermal Management Systems for Defense Electronics

Air-Cooled Chassis, Liquid Cold Plates, and Phase-Change Thermal Hardware

Perseus designs integrated thermal management systems for defense electronics operating in airborne, naval, ground, and high-reliability environments. Architecture options include fan-assisted air-cooled enclosures up to 2,000 W per chassis, liquid-cooled systems managing heat flux density up to 200 W/cm² at the module interface, and passive thermal hardware such as heat pipes and phase-change cold plates for transient heat loads.

Air-Cooled Chassis, Liquid Cold Plates, and Phase-Change Thermal Hardware

Perseus designs integrated thermal management systems for defense electronics operating in airborne, naval, ground, and high-reliability environments. Architecture options include fan-assisted air-cooled enclosures up to 2,000 W per chassis, liquid-cooled systems managing heat flux density up to 200 W/cm² at the module interface, and passive thermal hardware such as heat pipes and phase-change cold plates for transient heat loads.

Core Technical Features

Integrated Fan and Chassis Ecosystem:

Perseus can coordinate airflow source, enclosure architecture, and system impedance to reduce interface risk in thermal design reviews.

High-Capacity Heat Dissipation:

Air-cooled enclosures can support up to 2,000 W per chassis, while liquid-cooled architectures can support up to 200 W/cm² at the module interface by configuration.

Liquid Cold Plate Integrity:

Vacuum-brazed and friction-stir-welded cold plate concepts can be reviewed for PAO, EGW, or Jet-A compatible cooling loops.

Passive and Transient Thermal Control:

Heat pipe assemblies and phase-change material cold plates help manage short-duration thermal spikes when steady-state airflow alone is not sufficient.

Typical Applications

Airborne Mission Computers and Radar Systems

Airborne Mission Computers and Radar Systems

Shipboard Electronics Cabinets

Ground Mobile Command and Control

Compact Payload and Guidance Electronics

Compact Payload and Guidance Electronics

Series Selection Guide

Series 1: Air-Cooled Chassis

Configuration	Slot Count	Module Standard	Thermal Capacity	Cooling Method	Weight	Dimensions	Operating Temp
1/2 ATR Air-Cooled	3U modules	VPX / CPCI / ASAAC	Up to 800 W	Aerospace fans	~13.5 kg	315 x 194 x 124 mm	By configuration
1 ATR Air-Cooled	3U modules	VPX / CPCI / ASAAC	Up to 2,000 W	Aerospace fans	~27.5 kg	315 x 194 x 256 mm	By configuration
4 MCU Air-Cooled	3U / 6U modules	VPX / custom	Up to 1,000 W	Centrifugal fans	Custom	Custom	By configuration
VPX Air-Cooled	8 x 6U VPX	VITA 46 / 48	Up to 1,000 W	Axial fans	Custom	Custom	By configuration

Series 2: Conduction-Cooled Chassis

Configuration	Slot Count	Module Standard	Thermal Capacity	Heat Sink Type	Weight	Dimensions	Operating Temp
1/2 ATR Conduction	3U modules	VPX / CPCI / ASAAC	Up to 800 W	Machined aluminum	~13.5 kg	315 x 194 x 124 mm	-55°C to +85°C
4 MCU Conduction	3U / 6U modules	VPX / custom	Custom	Finned heat sink	Custom	Custom	-55°C to +85°C
Custom ATR Conduction	Variable	ASAAC / custom	Up to 800 W	Cold plate / conduction path	Custom	Custom	-55°C to +85°C

Series 3: Liquid-Cooled Chassis

Configuration	Slot Count	Module Standard	Heat Flux Density	Cold Plate Type	Weight	Dimensions	Operating Temp
4U Liquid-Cooled Rack	VPX modules	VITA 48	50-200 W/cm²	Blind-mate connectors	Custom	4U rack height	By configuration
Airborne Liquid-Cooled	Variable	VPX / custom	50-200 W/cm²	Serpentine flow path	Custom	Custom	By configuration
RF Liquid-Cooled	High-power RF	Custom	Up to 200 W/cm²	Microchannel option	Custom	Custom	By configuration

Integrated Thermal Management Modules for Defense Electronics

Perseus integrated thermal management modules combine high-performance cooling fans, optimized heat exchangers, air filtration, and mounting provisions into pre-engineered assemblies for defense electronics systems. These modules provide validated thermal performance in ruggedized packages designed for radar enclosures, avionics bays, vehicle electronics compartments, and shipboard cabinets requiring reliable forced-air cooling.

Thermal modules are engineered for operating conditions from -55°C to +85°C with environmental qualification planning available per MIL-STD-810H for shock, vibration, humidity, salt fog, and temperature cycling. Integrated designs include fan speed control options, tachometer feedback, fault detection, and EMI filtering compatible with military power systems (28VDC, 115VAC 400Hz). Module configurations can be tailored to specific thermal loads, airflow requirements, and available envelope constraints.

Engineering answer: Integrated thermal modules should be selected based on total heat dissipation, maximum allowable component temperature, available airflow path, and environmental conditions. Pre-engineered modules reduce integration risk compared to discrete fan and heat sink assemblies because airflow impedance and thermal performance are characterized as a complete system.

Engineering answer: When specifying thermal modules, include derating for high-altitude operation, filter clogging over the maintenance interval, and worst-case component power dissipation. Maintaining adequate margin ensures reliable cooling performance throughout equipment service life under field conditions.

Engineering Resources

Technical guides to support your fan selection and system integration.